NXQ8000

R&D and Production Mask Aligner

Multiple contact & proximity exposure modes
Wafer size from pieces to 200 mm diameter
Square substrate up to 6" x 6"
Optical and CCTV splitfield microscope options
Simple topside mask loading
Manual tray loading feature

Modular design, easily configurable for wide variety of applications with available options:

• Robotic autoload handling
• Automatic alignment
• Optical (OBS) and Infrared (IR) backside alignment
• Large gap alignment
• UV / NUV / DUV Exposure optics